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ADLINK Express-SLE-E3-1515M w/TPM 2.0 Basic COM Express Type 6 module with 6th Intel Xeon E3-1515M processor at 2.8/3.7GHz with

FJ $4,530.02 excl. VAT

ADLINK Express-SLE-E3-1515M w/TPM 2.0 Basic COM Express Type 6 module with 6th Intel Xeon E3-1515M processor at 2.8/3.7GHz with CM236 chipset, w/ TPM 2.0

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Industrial Embedded Computers

Description

The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
The Express-SL/SLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution. The Express-SL/SLE features Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR4 dual-channel memory at 1866/2133 MHz with ECC/non-ECC support determined by CPU/chipset combination to provide excellent overall performance.
Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel® QM170, HM170, CM236 Chipset. Integrated Intel® Generation 9 Graphics includes features such as OpenGL 4.4/4.3/4.2, DirectX 11, IntelR Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC, MPEG2 hardware codec. Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option.
The Express-SL/SLE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The Express-SL/SLE has dual stacked SODIMM sockets supporting up to 32 GB of DDR4 ECC/non-ECC memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, eight PCIe x1 Gen3 lanes, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.




Specifications
6th Gen Intel® Core™, Xeon® and Celeron® Processor with Intel QM170/HM170/CM236 Chipset (codename: Skylake) Up to 32GB dual channel ECC or non-ECC DDR4 at 2133 MHz 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays 8 PCIe x1 and 1 PCIe x16 GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0 Supports Smart Embedded Management Agent (SEMA) functions Extreme Rugged operating temperature: -40°C to +85°C (build option for Core & Celeron 25W TDP SKUs)


Manufacturer Part No:

91-72128-S150
Brand:

ADLINK

Product Type:

Express Type 6 module
UPC

-
Product Family:

Express-SLE-E3-1515M
Shipping Weight:

1 kg
PB Part No:

IPCADL00014
Product Model:

w/TPM 2.0 Basic COM



Warranty:
12 months *
* Warranty period is as stated above unless the manufacturer has chosen to specify a longer period.
All warranties are return to base unless otherwise specified.

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